From October 15th to 17th, 2025, the WESEMiBAY Semiconductor Ecosystem Expo 2025 (“WESEMiBAY” in short) was held at the Shenzhen Convention and Exhibition Center. As a key player in the semiconductor supply chain, Bondex Group showcased its smart solutions at this global industry event, joining hands with over 600 exhibitors and more than 110,000 professional visitors to co-create a new blueprint for the chip industry!
Expo Highlights: Global Chip Power, New Momentum in the Bay Area
Centered around the theme of "Chip Initiates the Future, Intelligence Creates the Ecosystem", this year's expo brought together top players from the global semiconductor industry chain. Covering everything from chip design to advanced packaging, and from equipment and material innovation to intelligent applications, it served as a convergence point for all core links of the industry chain. The expo venue was bustling with visitors, featuring intensive releases of cutting-edge technological achievements and insightful exchanges at professional forums – truly an annual "innovation hub" for the semiconductor industry!
Glimpses of the Bondex Booth (9Q16):
Engaged with new and existing customers, as well as government delegations, conducting in-depth exchanges on industry trends and collaboration opportunities. Showcased Bondex’s cross-border end-to-end one-stop intelligent supply chain service framework. The professional interpretations by the Bondex team received high recognition from customers, leading to a vibrant atmosphere for negotiations at the booth. Notably, some customers confirmed their intentions to cooperate on the spot and proceeded with formal business collaboration the very next day.
Bondex Value: Professional Services Linking Trust
Responding to Industry Needs with Professional Capabilities:
Presenting customized service models by focusing on the core demands of the semiconductor industry chain for "Agility, Reliability, and Compliance,"; demonstrating full-chain risk control capabilities for high-value equipment and materials through scenario-based and digital-intelligent simulations.
Pursuing Development through Ecosystem Collaboration:
Exploring pathways for enhancing supply chain resilience with industry partners; gathering valuable suggestions from government agencies regarding regional infrastructure cooperation.
Setting Sail with Gratitude: With Professional Dedication, Towards Tomorrow's Promise
Three days in the Bay Area, filled with abundant harvest!
Bondex Group sincerely extends its gratitude to:
· All new and old friends who visited our booth 9Q16 – your trust is the driving force behind our progress;
· The organizing committee for creating an outstanding platform that gathers and ignites the power of the industry!
See You in Shenzhen in 2026!
Moving forward, we will continue to deepen our professional capabilities. With more mature intelligent supply chain services, we will grow in tandem with China's semiconductor industry and embark together on the new "chip" journey!
